Sun Server X3-2 / X4-2 System Boards

7048712
Assembly/FRU
7046330 + Tray
Tray 350-1832

X3-2 Notes

1. The minimum Solaris operating system is Solaris 10 8/11 and Solaris 11 11/11.

X3-2 Thermal Grease Notes

1. Heatsink 7020774 is pre-greased with ShinEtsu X23-7783D.
2. The System Board FRU includes two 250-1802 Cleaning Wipes, two 310-0065
   Shin-Etsu X23-7783D Thermal Grease Syringes, and CPU tool 7026168.

X3-2 Memory Installation Notes

1. DIMM filler panels are not required in sockets that do not have DIMMs installed.
2. All CPU1 DIMM sockets must remain empty in single CPU systems.
3. Install DIMMs in the Blue slots first in slots D0, D2, D5, and D7.
4. Then install DIMMs in the White sockets in slots D1, D3, D4, and D6.
5. Install the highest capacity DIMMs first. Install the highest rank DIMMs first.
6. When Dual Rank and Quad Rank DIMMs are installed in the same channel,
   install the Quad Rank DIMMs in the slots farthest from the CPU.

X3-2 System Board Notes

1. Do not remove the System Board Air Guide/Handle.
2. Torx fasteners are not intended to be removed in the field.
3. The System Board is fastened to the Chassis with Midwall 7014793.
4. The System Board SAS0-3 and SAS 4-7 connectors are not installed.
5. To remove the System Board, disconnect the Backplane SAS Cables, Backplane
   Power Cable, Backplane Flex Cable, DVD Data Cable, and Front Indicator Cable.
   Remove the Fans, PCI Risers, Power Supplies, and Midwall, then the System Board.

X3-2 PCI Express Riser Notes

1. The HBA in Riser-3 uses an unknown non-standard PCI Bracket.
2. The Disk Backplane data cables connect to an HBA in Riser-3 Slot-4.