7038932
System Board Assembly
System Board 7026366

Sun Blade X3-2B Notes:

Notes

1. The minimum Solaris operating system is Solaris 10 8/11 or Solaris 11 11/11.
2. The part number of the unprogrammed Oracle System Assistant USB is 7038488.
3. Heatsink 7020774 is pre-greased with Shin-Etsu X23-7783D. The Heatsink includes
   Heatsink 7020774, one 250-1802 Cleaning Wipe, and one 310-0065 Shin-Etsu
   X23-7783D Thermal Grease Syringe.
4. The Blade CRU/FRU includes two 250-1802 Cleaning Wipes, and two 310-0065
   Shin-Etsu X23-7783D Thermal Grease Syringes.
5. CPU Tool 7026168 was added to the System Board FRU in January 2014.

Chassis Notes

1. The X6270 M3 / X3-2B is supported in Sun Blade 6000 A90-B, and A90-D.
2. The Sun Blade 6000 A90-A requires A90-B midplane upgrade A90-B-MP-UPGKIT.
3. Midplane upgrade A90-B-MP-UPGKIT was announced as EOL in March 2011.
4. The Sun Blade 6000 midplane can be obtained by purchasing the midplane spare.
5. The Sun Blade 6000 midplane must be replaced by a qualified service provider.
6. The X6270 M3 / X3-2B is not supported in Sun Blade 6000 A90-A or Sun Blade 6048.

Memory Installation Notes

1. Install DIMMs in the blue slots first.
2. Install DIMMs in the white slots second.
3. Install DIMMs in the black slots third.
4. CPU0 and CPU1 require identical memory configurations.
5. Each CPU supports one, two, or three DIMMs per socket color.
6. Install the highest capacity DIMMs in the blue sockets, then white, then black.
7. DIMM Slot Fillers are optional, and are not required for cooling.
8. Memory Filler Panel 350-1288 was removed in September 2012.
9. Memory Filler Panel requirements were removed from service label 7013716 Rev 05.
10. Refer to the service manual for additional memory configuration information.

Sun Blade X4-2B Notes:

Notes

1. The minimum Solaris operating system is Solaris 10 1/13 and Solaris 11.1.
2. Sun Blade X4-2B is a modified Sun Blade X3-2B with unique BIOS, ILOM and FRUID.
   Do NOT use Sun Blade X3-2B to replace Sun Blade X4-2B.
3. Sun Blade X4-2B 7083444 requires SW 1.1 to support the PI2EQX5964 PCI Express
   ReDriver that replaced the PI2EQX5864 at U2301, U2302, U2401, and U2402.
4. Heatsink 7020774 is pre-greased with Shin-Etsu X23-7783D. The Heatsink includes
   Heatsink 7020774, one 250-1802 Cleaning Wipe, and one 310-0065 Shin-Etsu
   X23-7783D Thermal Grease Syringe.
5. The Blade CRU/FRU includes two 250-1802 Cleaning Wipes, and two 310-0065
   Shin-Etsu X23-7783D Thermal Grease Syringes.
6. Tools 7026168 and 7082521 were added to the System Board FRU in January 2014.
7. The Sun Blade 6000 Storage Module is not supported with the Sun Blade X4-2B.

Chassis Notes

1. The X4-2B is supported in Sun Blade 6000 A90-B, and A90-D.
2. The Sun Blade 6000 A90-A requires A90-B midplane upgrade A90-B-MP-UPGKIT.
3. Midplane upgrade A90-B-MP-UPGKIT was announced as EOL in March 2011.
4. The Sun Blade 6000 midplane can be obtained by purchasing the midplane spare.
5. The Sun Blade 6000 midplane must be replaced by a qualified service provider.
6. The X4-2B is not supported in Sun Blade 6000 A90-A or Sun Blade 6048.

Memory Installation Notes

1. Install DIMMs in the blue slots first.
2. Install DIMMs in the white slots second.
3. Install DIMMs in the black slots third.
4. CPU0 and CPU1 require identical memory configurations.
5. Each CPU supports one, two, or three DIMMs per socket color.
6. Install the highest capacity DIMMs in the blue sockets, then white, then bla ck.
7. Refer to the service manual for additional memory configuration information.